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 层数/ Layers:1-Layers 板厚/ Thickness: 0.15mm 最小孔径/ Min.Hole Size: 0.15mm 线宽线距/ Width/Spacing:3.0/3.0mil 表面处理/ Surface Treatment: ENIG 补强/ Stiffener:N/A 特别要求/ Special: 5 M  
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Technology Capability Introduction:
| Design: 1 to 10 layers, plated-through Conductor width min.:0.1mm  Impedance control:Yes (10% tolerance) | 

 
			     
          
   			  