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New Project ---Rigid Flex PCB designed with HDI 1+N+1

 Release time:2015-05-15 09:09:32

         New project of Rigid Flex PCB have just been completed by our R & D department, it was a 6Layer rigid +2Layer Flex which designed with HDI 1+N+1 laser drilling.FR4 TG170, board thickness 1.2mm ,Copper 1oz, ENIG , Solder mask Green, Special Process: Via in Pad need to be resin filled + plating pluged.

Technical Parameters
Part Number:T06C24586
Layer count:6
Board thickness:1.2mm
Raw material:FR4+PI+NFPP
Copper thickness on the board surface:≥35um
Copper thickness in the hole barrel:20um
Min.line width/space:0.075mm
Minimum hole diameter:0.20mm
Surface finishing:immersion gold≥1u"
Application:intelligent bracelet.